Projektbeispiele:
Auswahl Veröffentlichungen:
K. Meier, M. Röllig, A. Schießl, K.-J. Wolter: Life Time Prediction for Lead-free Solder Joints under Vibration Loads. Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE), Linz, 2011.
M. Röllig, B. Böhme, K. Meier, R. Metasch: Determination of Thermal and Mechanical Properties of Packaging Materials for the Use in FEM-Simulations. AIP 2011, AIP Conference Proceedings, vol.1378, nr. 1, pp. 79-103, http://link.aip.org/link/?APC/1378/79/1,doi 10.1063/1.3615697, 12. September 2011.
M. Röllig, R. Metasch, K. Meier, F. Alt: Characterization Methods for Determination of Temperature Depended Electrical, Thermal, Mechanical and Fatigue Properties of SnAg3.5 Solder. Proceedings of the 3rd Electronics Systemintegration Technology Conference, Berlin, 2010.
M. Röllig, L. Schubert, U. Lieske, B. Boehme, B. Frankenstein, N. Meyendorf: FEM assisted Development of a SHM-Piezo-Package for Damage Evaluation in Airplane Components. International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Bordeaux (France), 2010.
B. Böhme, M. Röllig, K.-J. Wolter: Moisture Induced Change of the Viskoelastic Material Properties of Adhesives for SHM Sensor Applications.
International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, Bordeaux (France), 2010.
R. Metasch, M. Röllig, K.-J. Wolter: A novel Thermo-Mechanical Test Method of Fatigue Characterization of Real Solder Joints. European Microelectronics and Packaging Conference, EMPC, Rimini, 2009.
N. Meyendorf, K.-J. Wolter, H. Heuer, B. Köhler, P. Krüger, U. Netzelmann, M. Oppermann, M. Röllig, F. Schubert, Q. Zhan: Micro- and Nano-NDE for Reliability in Microelectronics. Goldbogenverlag.