EuroSimE | International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
The 18th EuroSimE will be held from April 2–5, 2017 in Dresden, Germany.
The conference addresses both the results of fundamental research and industrial applications in these fields. Novel results from cooperative work of measurement tools and software suppliers, industrial product developers and scientists will be published.
Short courses will be offered for professional training on April 2, 2017. Three days of technical sessions (April 3–5, 2017) for oral and poster presentations are planned, in parallel with an exhibition of suppliers of experimental characterization equipment, and simulation and optimization demonstrating their latest features.
Registration: Please register on the following webside EuroSimE Portal
Contact: Olivier de Saint Leger firstname.lastname@example.org
Dr. Mike Röllig email@example.com
Location: Dresden / Germany
Große Meißner Str. 15